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May 04, 2024
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ME 5360 - Electronic Product Design and Reliability
Credits: 3
Investigates the failures, failure modes, and failure mechanisms in electronic systems. Covers failure detection, electrical simulation, and environmental stress tests. Also, failure analysis, including the use of X rays, thermal imaging and infrared microscopy, acoustical imaging, scanning laser acoustic microscopy, infrared spectroscopy, differential scanning calorimeter, thermomechanical analyzer, and other testing procedures. Discusses solder joint reliability of ball grid array assemblies, plastic ball grid array assemblies, flip chip assemblies, and chip scale package assemblies, as well as fine pitch, surface mount technology assemblies. Explores temperature as a reliability factor, an overview of high-temperature electronics, the use of silicon devices at high temperatures, and the selection of passive devices for use at high temperatures. Prerequisite: ME 3340 or graduate student standing.
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