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Mar 11, 2026
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ME 5359 - Analysis and Design of Optoelectronic Packaging
Credits: 3
Provides an overview of optical fiber interconnections in telephone networks, packaging for high-density optical back planes, and selection of fiber technologies. Also, semiconductor laser and optical amplifier packaging, optical characteristics and requirements, electrical properties, mechanical properties, waveguide technologies, optical alignment and packaging approaches, passive device fabrication and packaging, array device packaging, hybrid technology for optoelectronic packaging, and flip-chip assembly for smart pixel arrays.
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